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identified with the supplier’s Functional Test (FT) stamp.
159.4.7 Log/Maintenance Cards
The following are the types of Log/Maintenance Cards:
Life Limited Part Log is used to document the accumulated hours/cycles, service and or maintenance
actions of specified hardware that has a maximum limit on hours and or cycles.
Ultimate Life Part Log Card (APU) is used to document the accumulated hours/cycles, service and or
maintenance actions of specified hardware that has a maximum limit on hours and or cycles.
Component Maintenance/Modification Record Card is used to record maintenance actions, service
bulletin compliance, etc., on specified components.
All Log/Maintenance cards shall be completed as defined and returned with the hardware.
159.4.8 Nonconforming Material Identified During Maintenance*
The supplier shall segregate and return to the Honeywell site initiating the purchase order, all scrap material
identified or incurred within the maintenance of the part(s).
The supplier shall specify the reason for return on the packing list or equivalent.
159.5 Shipping Certification Requirements
159.5.1 FAA 8130-3 or Equivalent Forms (i.e. EASA Form One, 24-0078, etc.)*
FAA 8130-3 or equivalent forms are required when:
Supplier is NAA approved
If CAAC approved, then an AAC-038 is required.
FAA 8130-3 or equivalent forms information required:
Block 5 and/or block 13, record the Honeywell purchase order (PO) or Honeywell Repair Order Number, or
as required by the Honeywell site
Block 13 EASA statement required if approved/accepted by the EASA.
Block 19 Dual Release Certification required if the repair station is EASA accepted / approved.
Note: Suppliers located in countries with bilateral agreements with the FAA and EASA shall release product
with a Dual Release Certification.
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Attachments required (as applicable):
Rework Route Tag or equivalent (Reference 159.4.4).
Teardown and/or Findings Report or equivalent (Reference 159.4.5).
Test data sheets (Reference 159.4.6).
Log/maintenance cards (Reference 159.4.7).
Nonconforming material report as applicable.
A replacement of the original certificate must be provided for the following:
A. Hardware returned due to correcting a nonconformance.
B. Documentation returned due correcting a nonconformance.
Note: If the technical data does not allow the supplier to issue a FAA 8130-3 or equivalent form for the
repair, then the supplier must provide an FAA 8130-3 or equivalent form for the inspection and additional
certifications for the repair, as required (e.g., Honeywell SFAR-36 repairs).
159.5.2 Certificate of Conformance
A Certificate of Conformance in accordance with SPOC 140 is required when:
Supplier is not a holder of a National Aviation Authority approved Air Agency Certificate.
Products are used for military programs (reference the PO).
Data is not regulatory and/or OEM approved
159.5.3 Packing Documentation Requirements
Statement that parts/materials conform to the applicable technical data, specifications, and Purchase order.
Purchase order number.
Purchase order part number.
Serial numbers (as applicable).
Repair Order (RO) number identified on the purchase order.
Shipment quantity.
Other requirements as defined in the purchase order.
Revisions: Major revisions and reformatting.
*Revised / **Added
SPOC 162 – Electronic and Electrical Components with Lead (Pb) and Pb-free Finishes **
These requirements apply when evaluating changes to existing production hardware, changes to components used within
production hardware and in the evaluation of all components and solder materials on new production hardware.
Use of tin-lead and lead free component termination finishes for Honeywell product shall be managed through the use of
Honeywell Engineering Specification HPS1006 (Aerospace Process Specification for the Implementation of Lead Free Finished
Electronic Parts with Tin/Lead Solder) unless otherwise specified by the program. Note that HPS1006 is intended to assure
compliance to the GEIA-STD-0005-1 requirements.
162.1 Solder Joint Integrity and Component Finishes
Section 3.1.1, Table 1 of HPS1006 documents the acceptable combinations of lead finish systems that provide reliable
solder joints and is to be used for all Honeywell Aerospace printed board assemblies.
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162.2 Tin Whisker Mitigation for Component Finishes
Section 3.1.2 of HPS1006 documents the approaches that are used when mitigating the risk of failure due to tin
　
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