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553.1 Clearwater Orders Only
Two parts from each inspection lot shall be shipped to Honeywell for destructive physical analysis. DPA samples shall be
pulled after preburn-in electrical tests, and may be marginal parametric failures (no catastrophic failures). DPA samples shall
be marked with a red dot, "x", or -DPA and, as a minimum, the lot and serial numbers.
Revisions: Rewritten for clarity. Consolidated basic requirement statement.
SPOC 554 – Weld Sample Requirements – CANCELLED
Revisions: SPOC cancelled. Contents covered in SPOC 165.
SPOC 555 – Electron Beam Welding Requirement – CANCELLED
Revisions: SPOC cancelled. Contents covered in SPOC 140.
Aerospace
Supplemental Purchase Order Conditions (SPOC) Manual
UNCONTROLLED IN HARDCOPY
Revision H Effective Date: 15 January 2009 97
SPOC 556 – X-Ray Requirement for Capacitors – CANCELLED
Revisions: SPOC cancelled.
*Revised / **Added
SPOC 557 – X-Ray Film Required *
X-ray film (uncut sheets with penetrameters intact) is required. Film and marking shall include:
• device manufacturer
• device type
• production lot code or date code
• radiographic film view number and date
• device serial number or cross reference list, and
• x-ray laboratory identification (if other than manufacturer).
557.1 Deer Valley and Glendale Orders Only
X-ray (or Radiographic) inspection film of parts must be supplied with each shipment. X-rays must be traceable to the
supplier’s lot and/or serial numbers of the parts supplied.
Revisions: Rewritten for clarity. Consolidated basic requirement statement.
SPOC 558 – Workmanship Standard
Specification 001-06001-0000 is a requirement of this order.
Revisions: No changes.
SPOC 559 – Honeywell Clearwater Specific Requirements (individually applicable as
noted on PO) – CANCELLED
Revisions: SPOC cancelled.
Aerospace
Supplemental Purchase Order Conditions (SPOC) Manual
UNCONTROLLED IN HARDCOPY
Revision H Effective Date: 15 January 2009 98
*Revised / **Added
SPOC 560 – Integrated Circuit (ICT) and Flying Probe (FP) Requirements **
The supplier shall perform circuit testing by either ICT or FP prior to shipment to Honeywell, and shall provide certified test
coverage report that:
• lists each reference designator tested by each method
• submitted as part of the FAI report (and subsequent delta FAI reports)
• maintained on file at the supplier facility.
The supplier shall maintain proper revision controls for all test procedures.
560.1 Integrated Circuit Testing
Method 1 ICT testing is the preferred electrical testing method. Each board shall be marked using permanent ink with
the letters "ICT" indicating successful completion of ICT manufacturing test. Stamps/markings shall be placed in a
location where it is assured that subsequent manufacturing steps will not conceal verification.
560. 2 Flying Probe Testing
Flying probe testing shall be performed when ICT not available. Each board shall be marked using permanent ink the
letters "FP" indicating successful completion of Flying Probe test. Stamps/markings shall be placed in a location where
it is assured that subsequent manufacturing steps will not conceal verification.
Revisions: New SPOC.
Appendix I – SPOC 239 Packaging and Package Identification – CANCELLED
Revisions: Appendix cancelled, 239 moved to body of SPOC.

　
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