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DAR090709
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SC100712 TMT Overview
Major Customers & Technologies
•Boeing
•DRS
•Goodrich
•ITT
•L3 Communications
•Maxwell
•Northrop Grumman
•Raytheon
•Sierra Monolithics
•St. Jude
Mixed Signal
•Boeing
•Comtech PST
•ITT
•L3 Communications
•Lockheed Martin
•National Instruments
•Raytheon
•Rockwell Collins
•Sierra Monolithics
RF/Microwave
•Boeing
•Goodrich ISR
•Harris
•Honeywell
•L3 Communications
•Opticomp
•Raytheon
•RIO
•Rockwell Collins
Optoelectronics
•Airbus
•BAE Systems
•Boeing
•Borisch
•Curtiss Wright
•Diehl
•GE Aviation
•Hamilton Sundstrand
•Honeywell
•Lockheed Martin
Power
•BAE Systems
•Boeing
•ITT
•NSA (MPO)
•Raytheon
•SafeNet
•Sandia
•SPAWAR
•Trimble
•VIASAT
Secure
Communications
•Aerojet
•Astrium
•Boeing
•Harris
•ITT
•JPL
•L-3 Communications
•Lockheed Martin
•Moog
•Northrop Grumman
Space
•Fourth Dimension
•Intervac Photonics
•Kopin
•NVIS
•Red Digital Cinema
•Rockwell
•Schott
LED Backlights
& Illuminators
Smaller
Size
Lighter
Weight
Lower
Power
Improved
Performance
and Reliability
5
SC100712 TMT Overview
RF & Microwave Technologies
 Housing: Aluminum LTCC, Kovar
 GPPO, GPO, SMA connectors
 Substrates/Laminates
– Thick/thin film microstrip, stripline, coplanar
– LTCC, PTFE (Teflon), Rogers, FR4 with embedded
Rogers
– Multiple substrate construction: thick film substrate with
thin film daughter boards
 Active or passive laser trim
 Surface mount assembly (mixed mode)
 Die Attach
– Eutectic
– Epoxy
– Flip chip
 Wire Bonding
– 0.7, 1 mil gold
– Manual ribbon
 Microwave, thermal/mechanical
modeling analysis and simulation
 Testing to 65 GHz
Prototype to full scale production of complex, mixed technology and miniaturized assemblies
DAR090709
6
SC100712 TMT Overview
Optoelectronics Advanced Design & Packaging
8 Optical Rx & Tx
• 500 Mbps
• 1.5” x1”x 0.15” ea
Quad Optical Transceiver
• 2.5 Gbps per channel
• 1” x 1” x 0.2”
Prototype to full scale production of complex, mixed technology and miniaturized assemblies
DAR090709
 Standard Ruggedized Fiber Optic RX, TX and XCVRs
– Up to 10 Gbps, -40°C to +95°C, soon 105°C
– High Reliability Industrial Packaging & Components
– Extended shock and vibration, moisture resistant
– Standard connector interface: LC/MT/FC and others
– SM, MM, Ethernet, Duplex, Multiplex
Chip-SFF: 1.9” x 0.5” MINI: 0.8” x 0.5” Scale: 0.375” x 0.375”
 Custom Ruggedized Fiber Optics RX, TX and XCVRs
– High Reliability, Hermetic, MIL-PRF-38534 Class H
7
SC100712 TMT Overview
Mixed SMT with Chip-n-Wire
 Multi-Chip Modules on Laminate
– Defense, Industrial, Space Applications
 Developed custom Qualification Profile
 Preconditioning per JESD22-A113B (to JEDEC Level 3)
– Encapsulation examination with Sonoscan
– Bake out: 24 hours at 125°C, unbiased
– Humidity soak: 192 hours at 30°C and 60% relative humidity, unbiased
 84 hour High-pressure Steam Autoclave per JESD22-A102C
– Temperature: 121°C
– Relative humidity: 100%
– Vapor pressure: 29.7 psia
 Temperature Cycling per JESD22-A104B
– Temperature range: –55°C to +150°C
– Cycles: 500
– Transition rate: 10°C/minute
– Soak time at extremes: 5 minutes
 44 hour Highly-Accelerated Stress Test (HAST) per JESD22-A110B
– Temperature: 130°C
– Relative humidity: 85%
– Vapor pressure: 29.7 psia
Defense Mixed Technology
SMT and Wirebonding
　
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