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A8 card Video signal generator card assembly
E. Electrostatic discharges from your hands or tools can cause permanent
damage to most of the semiconductor devices on the printed circuit card
assemblies. Obey the general precautions given below to prevent such
damages:
• Do the disassembly and assembly work on a grounded conductive surface.
• Put on a conductive wrist-strap that is grounded.
• Touch your tool to the ground (grounded metal structure, etc.) before
you use it.
• Use a tip-grounded soldering iron.
Page 602
Nov 20/2006
Panasonic Avionics Corporation
COMPONENT MAINTENANCE MANUAL
PART NUMBER RD-AA5002 SERIES
23-32-47
2. Tools and Materials Necessary for Repair
NOTE: You can use alternatives for the items given in the list. The source
is as follows:
• Panasonic for Panasonic Avionics Corporation
• C/A for available from commercial sources
• Trademarks or company names for other sources.
ITEM (SOURCE) DESCRIPTION
Power Desoldering
Station (C/A)
Type suitable for multilayer applications with vacuum
pump suction, grounded tip.
Soldering Iron for
Tin-Lead Solder (C/A)
Type and size good for repair of electronic equipment,
grounded tip.
Soldering Iron for
Lead-Free Solder (C/A)
Type and size good for repair of electronic equipment,
grounded tip. Higher temperatures are necessary for
soldering with lead-free solder.
Toothbrush (C/A) Use this with alcohol or purified water to clean the
dirty areas on the printed circuit card assemblies.
Standard Tools (C/A) Use them as necessary.
Contact Removal Tool
for Straight Coax
Contacts (C/A)
Use this to remove the coax contacts from the A5CN6
thru A5CN18 connectors on the A5 card. You can get
this tool from:
• Siemens.
P/N C42407-A67-A1 (70-mm long) or C42407-A67-A2 (200-
mm long).
• Hirose Electric Co., Ltd., Tokyo, Japan.
P/N PO51P-T-1 (CL350-0037-1).
Contact Removal Tool
for Right-Angle Coax
Contacts (C/A)
Use this to remove the coax contacts from the A2CN201
connector on each A2 card. You can get this tool from:
• Hirose Electric Co., Ltd., Tokyo, Japan.
P/N PO51J-T-1 (CL350-0038-4).
Contact Removal Tool
for Straight Coax
Contacts in J1 Middle
Plug (C/A)
Use this to remove the coax contacts from the A2CN201
connector on each A2 card. You can get this tool from:
• Pan Pacific Electronics, 17985 NE 65th Street,
Redmond, Washington 98052, USA
P/N M81969/28-01.
Tin-Lead Solder (C/A) Tin-lead alloy, non-corrosive flux core, wire form.
Page 603
Apr 20/2008
Panasonic Avionics Corporation
COMPONENT MAINTENANCE MANUAL
PART NUMBER RD-AA5002 SERIES
23-32-47
(Cont'd)
ITEM (SOURCE) DESCRIPTION
Lead-Free Solder,
R7HRACFW06M or
R7HRACFW10M
(Panasonic)
(Refer to the right
for the vendor and
vendor part number)
· R7HRACFW06M: 0.6 mmÆ (0.024 in) wire and 500 g/roll
· R7HRACFW10M: 1.0 mmÆ (0.039 in) wire and 1 kg/roll.
You can also get the same lead-free solder from:
Senju Metal Industry Co., Ltd.
ECO-solder RMA98 SUPER P3 M705
0.6 or 1.0 mm (wire dia.).
Wire (C/A) Stranded copper wire (MIL-W-22759/34 or equivalent) with:
· Teflon insulation
· Temperature rating of 150°C or higher
· Voltage rating of 600 V or higher.
Use one of the sizes given below for repair of printed
conductors if such repair does not make the performance
unsatisfactory:
· No. 28 AWG or thicker for conductor width 0.02”
(0.5 mm) or less.
· No. 26 AWG or thicker for conductor width 0.02”
(0.5 mm) thru 0.08” (2 mm).
· No. 24 AWG or thicker for conductor width 0.08”
(2 mm) or more.
Ethyl Alcohol or
Isopropyl Alcohol
(C/A)
Use this with toothbrush to clean the dirty areas on
the printed circuit card assemblies.
Purified Water (C/A) Use this with toothbrush to clean the dirty areas on
the printed circuit card assemblies. Water is good to
remove food stains.
Low-lint Cloth or
Tissue Paper (C/A)
Use this to dry wet surfaces.
Compressed air (air
jet) (C/A)
An air source and a nozzle with a manual control. The
nozzle gives an air jet at a pressure of 0.2 MPa
(28 psig) maximum. The air jet must be clean and dry.
Cotton Swab (C/A) Use this for general cleaning.
Silicone Heat Sink
Compound (Silicone
Grease) (C/A)
Apply this on power semiconductor devices to improve
　
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