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heat transfer to heat sink.
Insulating Compound
(C/A)
For conformal coating of worked area on printed circuit
card. MIL-I-46058C Type AR or equivalent.
Page 604
Jul 20/2005
Panasonic Avionics Corporation
COMPONENT MAINTENANCE MANUAL
PART NUMBER RD-AA5002 SERIES
23-32-47
(Cont'd)
ITEM (SOURCE) DESCRIPTION
Hot-Melt Glue,
P/N R7APA810
(Panasonic)
Polyamide-base glue, 0.46" (11.7 mm) dia. stick. Use
this to safety parts. Apply it with a glue gun that
heats glue to 180°C (356°F).
Page 604.01
Sep 20/2004
Panasonic Avionics Corporation
COMPONENT MAINTENANCE MANUAL
PART NUMBER RD-AA5002 SERIES
23-32-47
3. Replacement Procedures
A. General Procedure for Components on Printed Circuit Card Assemblies
(1) The printed circuit card/board assemblies that use lead-free solder
have a "PbF" label or "PbF" mark on one side of them. Before you
start soldering on a card/board assembly, do as follows:
(a) Look for the "PbF" label or "PbF" mark on the card/board
assembly.
(b) Use the lead-free solder specified in 2. if the card/board
assembly has the "PbF" label or "PbF" mark.
(c) Use the tin-lead solder (available from commercial sources) if
there is no "PbF" label or "PbF" mark on the card/board
assembly.
(2) The soldering temperatures and times are as follows:
(a) For Lead-Free Solder
SOLDERED
ITEM
SOLDERING-IRON
TIP TEMPERATURE
RECOMMENDED
HEAT TIME
General parts (IC devices
and chip components)
310 ± 20°C
(590 ± 36°F)
5 seconds maximum
High heat-content areas
(large printed foil areas
and terminals)
410 ± 20°C
(770 ± 36°F)
5 seconds maximum
(b) For Tin-Lead Solder
SOLDERED
ITEM
SOLDERING-IRON
TIP TEMPERATURE
RECOMMENDED
HEAT TIME
General parts (IC devices
and chip components)
290 ± 20°C
(554 ± 36°F)
5 seconds maximum
High heat-content areas
(large printed foil areas
and terminals)
400 ± 20°C
(752 ± 36°F)
5 seconds maximum
(3) Use two different soldering irons, one for lead-free solder and the
other for tin-lead solder.
Page 604.02
Nov 20/2006
Panasonic Avionics Corporation
COMPONENT MAINTENANCE MANUAL
PART NUMBER RD-AA5002 SERIES
23-32-47
CAUTION: BEFORE YOU TOUCH A PRINTED CIRCUIT CARD ASSEMBLY, PUT ON A
CONDUCTIVE WRIST-STRAP THAT IS GROUNDED. DO THE WORK WITH THE
UNIT PUT ON A GROUNDED CONDUCTIVE SURFACE. ELECTROSTATIC
DISCHARGES FROM YOUR HANDS OR TOOLS CAN CAUSE PERMANENT DAMAGE
TO MOST OF THE SEMICONDUCTOR DEVICES ON THE PRINTED CIRCUIT
CARD ASSEMBLIES.
WARNING: USE ETHYL ALCOHOL (OR ISOPROPYL ALCOHOL) ONLY IN WELL
VENTILATED AREAS.
(4) If the component to be replaced is safetied with hot-melt glue,
remove the hot-melt glue from the component and adjacent components.
Apply ethyl alcohol (or isopropyl alcohol) to the hot-melt glue with
a brush or cloth to make the removal of the glue easier.
(5) Desolder and remove the defective component. Obey the instructions
given below.
(a) Do not make the printed foils too hot with the desoldering tip
attached to the soldered area longer than necessary. Too much
heat causes the printed foil to come off from the base
insulation. Apply the desoldering tip again after the area is
sufficiently cool.
(b) If the area has a layer of insulating compound, first solder the
pins or leads to burn the layer, then desolder.
(c) If the solder around a pin or lead is not fully removed, solder
the pin or lead again with a sufficient quantity of solder, then
desolder.
(d) Clean the desoldering tip and solder collector of the
desoldering station from time to time, to keep the desoldering
station serviceable.
WARNING: USE ETHYL ALCOHOL (OR ISOPROPYL ALCOHOL) ONLY IN WELL
VENTILATED AREAS.
(6) Fully clean the desoldered areas of the printed circuit card
assembly with alcohol or water and a toothbrush.
(7) Put a dry, clean cloth or tissue paper against the wet areas to dry
the areas. Do not rub the wet areas with the cloth or tissue paper.
If you find cloth or paper pieces on the printed circuit card
assembly, remove them. You can also use an air jet to dry the
areas.
Page 605
Nov 20/2006
Panasonic Avionics Corporation
COMPONENT MAINTENANCE MANUAL
PART NUMBER RD-AA5002 SERIES
23-32-47
(8) Put the replacement component on the printed circuit card assembly.
　
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